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DARPA Technical Advisor - Materials Science

ECS Federal

ECS Federal

IT
Posted on Friday, May 3, 2024

ECS is seeking a DARPA Technical Advisor - Materials Science to work in our Arlington, VA office.

Job Description:

ECS is seeking a highly skilled Material Scientist (Technical Advisor) with expertise in heterogeneous integration, heterogeneous material synthesis, and submicron CMOS circuits to provide technical guidance and support in advanced materials and packaging technologies. The successful candidate will play a pivotal role in advising on materials selection, silicon fabrication processes, and integration methodologies to achieve program objectives. They will collaborate closely with cross-functional teams and external partners to drive innovation and deliver cutting-edge solutions.

Tasking may include:

  • Providing technical expertise in heterogeneous integration and material synthesis for advanced packaging solutions.
  • Advising on submicron CMOS circuit layout design and optimization for high-performance applications.
  • Analyzing materials properties and conducting in-depth assessments to inform technical decisions.
  • Collaborating with cross-functional teams to ensure alignment and integration of materials and packaging technologies.
  • Contributing to the development of design roadmaps based on materials science principles.
  • Participating in technical meetings and discussions to provide insights and recommendations.
  • Conducting gap analysis and identifying opportunities for technology advancement in materials and packaging.

Required Skills:

  • Active DOD secret clearance.
  • US Citizenship required per contract.
  • Master's degree in Material Science, Electrical Engineering, or related field, with a focus on silicon fabrication and materials science.
  • Deep understanding of materials physics and chemistry, particularly in relation to silicon, heterogeneous integration, and heterogeneous material synthesis.
  • Proficiency in analyzing materials properties and making technical judgments based on scientific principles.
  • Experience in submicron CMOS circuit layout design and optimization.
  • Strong problem-solving skills and ability to critically evaluate technical challenges.
  • Excellent communication and collaboration skills to work effectively with cross-functional teams.
  • Ability to provide technical leadership and guidance in materials science and packaging technologies.

Desired Skills:

  • Experience supporting DOD-related technology research programs.
  • Familiarity with memory suppliers engagement and technology requirements definition.
  • Prior experience in leading materials science projects or initiatives.
  • Knowledge of advanced node silicon fabrication and packaging processes.
  • Active TS/SCI clearance.

ECS is an equal opportunity employer and does not discriminate or allow discrimination on the basis of race, color, religion, sex, age, sexual orientation, gender identity or expression, national origin, ancestry, citizenship, genetic information, registered domestic partner status, marital status, status as a crime victim, disability, protected veteran status, or any other characteristic protected by law. ECS promotes affirmative action for minorities, women, disabled persons, and veterans.

ECS is a leading mid-sized provider of technology services to the United States Federal Government. We are focused on people, values and purpose. Every day, our 3800+ employees focus on providing their technical talent to support the Federal Agencies and Departments of the US Government to serve, protect and defend the American People.